|
Zuken USA Launches Packaging Tool as Part of New Roadmap Targeting Reduced Design Cycle Times
WESTFORD, Mass., Oct. 3 /PRNewswire/ -- Zuken USA announced its newest
Advanced IC Packaging Solution, Package Synthesizer, an integrated
optimization tool which automates the packaging design process for increased
product reliability and performance.
The tool is a critical element of the
company's Advanced Packaging (AP) roadmap to address both performance and
manufacturing issues during the design phase and ultimately reduce design
cycle times. Package Synthesizer provides an intuitive, integrated environment for
designing single, multi and stacked-die packages for BGA, CSP, flipchip and
high density, advanced technology substrates.
It features enhanced 3D
capabilities, real-time analysis and tighter integration with IC tools for
design and analysis verification, all major contributors for reducing time to
market for many package designs currently being developed in the industry. The tool combines die and ball pattern component generation, substrate
outline creation, netlist input and technology type into a single step.
The
BGA start-up tool automatically places components, assigns design and
technology rules, and readies the package for bond shell generation or
routing, in the case of flip chip technology.
Package Synthesizer applies a
parametric-driven generator to create both simple and complex bond shell
configurations, completely optimizing bond wire links based on constraint
values.
It offers analysis using Zuken's Hot-Stage 4 and integration to third
party parasitic extraction and simulation tools, including Ansoft's TPA(TM)
and HFSS(TM) products. The 3D Design Rule Constraints (DRC) enable JEDEC-standard wire bond
profiles to be automatically checked for interference with adjacent wire bonds
to both bond pads and power and ground rings.
This is a significant
time-saver since the wire profiles are checked per precise manufacturing
processes, which eliminates any design delays due to additional manufacturing
checks required at the wire bonding facility. ``The analysis tools provide the performance check while the 3D DRCs and
RCL reporting provide both design and manufacturing confirmation prior to
design committal,'' commented Rick Lagasca, director of AP/CR-5000 for Zuken.
``No other packaging solutions combine 3D DRC and 3D interactive features into
AP design.
This assures both customers and suppliers that the package is
manufacturable and meets the design constraints established for specific
processes.'' The tool also provides complete support for build-up technology, which is
becoming a standard for BGA, CSP, flipchip and few chip substrates to shrink
package size and increase performance.
It includes pre-defined, Web-based
Design Technology Rule Kits from leading build-up fabricators and meets
build-up design and fabrication rules to ensure a manufacturable substrate up
front. The Package Synthesizer radial router uses a line-of-sight approach to
solve unique BGA and CSP routing problems.
The free-angle router features
automatic multi-layer radial route functionality and radial net generation,
pin swapping and interactive 45-degree routing features with complete push and
plow of vias and traces. Package Synthesizer will be available October 2001 and priced at $65,000. About Zuken Zuken is one of the world's leading providers of professional software
solutions for the design of PCB/MCM/IC packages and systems.
These advanced
tool sets facilitate schematic capture, placement, routing and analysis, and
manufacture and test.
Used by the world's top 30 electronic product
manufacturers, the solutions operate under both UNIX and Microsoft Windows.
Zuken is the market sector leader in Japan and has offices throughout Europe
and the USA.
It is a global organization employing over 1,000 people and the
company is listed on Level 1 of the Tokyo Stock Exchange.
For more
information, visit http://www.zuken.com .
|
|
CaféTalk |
